To provide a heat treatment method for a substrate and a heat treatment furnace capable of early solving the temperature distribution within the substrate when carrying the substrate containing a film forming material between adjacent heating chambers having different set temperatures.
This method for heat treating the substrate containing the film forming material uses the continuous heat treatment furnace comprising a plurality of heating chambers 3 partitioned in the carrying direction of a heat treatment object and a carrying means for carrying the heat treatment object to the adjacent heating chamber 5, in which each heating chamber 3 or 5 has a heating means divided into some pieces at least in the carrying direction of the heat treatment object, each of which can be temperature-controlled by independent control systems. When the substrate 1 is carried between the heating chambers 3 and 5 having different set temperatures, the temperature set of each heating chamber 3 or 5 is changed synchronously with the carrying of the substrate 1, whereby the temperature distribution within the substrate 1 caused in the process of carrying is early solved.
NOIRI HIFUO
AOKI MICHIRO
