Title:
HEAT TREATMENT METHOD FOR WAFERS
Document Type and Number:
Japanese Patent JPS52139363
Kind Code:
A
Abstract:
PURPOSE:Cracking of wafers by thermal stress is prevented in the cooling process of the wafers by ruducing the temperature difference between the circumferential part and central part of the wafer at the time of heat treatment.
Inventors:
IWAMATSU SEIICHI
ONODERA SHIROU
USAMI AIKO
ONODERA SHIROU
USAMI AIKO
Application Number:
JP5538276A
Publication Date:
November 21, 1977
Filing Date:
May 17, 1976
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H01L21/205; H01L21/02; H01L21/22; H01L21/31; H01L21/324; (IPC1-7): H01L21/22; H01L21/31; H01L21/324