Title:
HEAT TREATMENT WITH LASER
Document Type and Number:
Japanese Patent JPH01184219
Kind Code:
A
Abstract:
PURPOSE:To efficiently and uniformly heat-treat the surface of a copper substrate by forming a plasma atmosphere on the surface of the substrate and projecting laser light to heat-treat the surface of the substrate. CONSTITUTION:A gas ionizable at low voltage such as Ar or Ne is fed to the surface of a copper substrate and high density plasma having about 10<17>/cm<3> electron density is generated by high frequency or microwave discharge. Laser light is then projected on the surface of the substrate in the plasma atmosphere. The projected laser light is absorbed in the high density plasma and becomes a high density heat source. This heat source heats the surface of the substrate and modifies the surface by hardening due to transformation from the solid phase or by a melting-solidifying process. The surface of the copper substrate is efficiently and uniformly heat-treated over a wide range.
More Like This:
| WO/2016/124656 | LASER MACHINING UNIT |
| JPS58186 | [Title of the Invention] A device which packs A tip |
| JP4242642 | Laser cutting of semiconductor materials |
Inventors:
SHIGEMATSU TAKASHI
Application Number:
JP825988A
Publication Date:
July 21, 1989
Filing Date:
January 20, 1988
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
B23K26/12; B23K26/352; C21D1/09; (IPC1-7): B23K26/00; B23K26/12; C21D1/09
Attorney, Agent or Firm:
Noriyuki Noriyuki (1 person outside)