Title:
ヒータ及びヒータシステム
Document Type and Number:
Japanese Patent JP7241646
Kind Code:
B2
Abstract:
To provide a heater that has a novel configuration related to power supply to a resistance heating element.SOLUTION: A heater 1 has an insulating substrate 2, a resistance heating element 11, and a power receiving coil 23. The substrate 2 has a top face 9a on which a wafer Wf is overlapped. The resistance heating element 11 extends along the top face 9a in the substrate 2. The power receiving coil 23 is for non-contact power transmission, held in the substrate 2, and electrically connected to the resistance heating element 11.SELECTED DRAWING: Figure 2
Inventors:
Muramoto Yasuto
Application Number:
JP2019157987A
Publication Date:
March 17, 2023
Filing Date:
August 30, 2019
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H01L21/683; H05B3/74
Domestic Patent References:
| JP2019507952A | ||||
| JP2068924A | ||||
| JP2014135464A | ||||
| JP6232047A | ||||
| JP2008034463A |
Foreign References:
| WO2017204083A1 | ||||
| WO2017183402A1 |
Attorney, Agent or Firm:
Yasuhiro Iijima
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