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Title:
HEATING APPARATUS, HEATING METHOD, MOLDING APPARATUS AND MOLDING METHOD OF PLASTIC MOLDING
Document Type and Number:
Japanese Patent JP2013020738
Kind Code:
A
Abstract:

To provide a heating apparatus and a heating method which allows for uniform heating of an irradiated surface, by irradiating the irradiated surface uniformly with the light from a light source, and to provide a molding apparatus and a molding method of a plastic molding capable of enhancing the transfer rate, productivity, and the like.

A heating apparatus 1 comprises a light pipe 2 having a square cross-sectional shape, a light box 3 having a square cross-sectional shape and connected with the pipe 2, and a light source 4 which is housed in the light box 3.


Inventors:
IWASAKI TSUTOMU
AOTANI MASATAKE
KIMURA SATOO
Application Number:
JP2011151395A
Publication Date:
January 31, 2013
Filing Date:
July 08, 2011
Export Citation:
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Assignee:
TOYO SEIKAN KAISHA LTD
International Classes:
H05B3/00; B29C33/06; B29C35/08; B29C59/02
Domestic Patent References:
JP2005074700A2005-03-24
JP2006137019A2006-06-01
JP2011061214A2011-03-24
JP2006088517A2006-04-06
JP2006231588A2006-09-07
JP2008288673A2008-11-27
JP2008254230A2008-10-23
JP2001313152A2001-11-09
JP2002289548A2002-10-04
JPH0798416A1995-04-11
JP2008188953A2008-08-21
JP2006088517A2006-04-06
JP2005074700A2005-03-24
JP2006137019A2006-06-01
JP2011061214A2011-03-24
JP2006231588A2006-09-07
JP2008288673A2008-11-27
JP2008254230A2008-10-23
Attorney, Agent or Firm:
Kihei Watanabe



 
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