To obtain a heating device for electronic components having no problems of dust contamination, can reduce burning treatment time, even if a glass substrate for LCD is to be sintered using a tool, and can improve productivity.

The heating device for electronic components has an infrared heat source 11 for heating an object to be heated through radiation of infrared rays, and a conduction heat source 12 for conducting and heating the object to be heated in contact with the tool 13 where the object to be heated is provided. One surface of the object to be heated that is provided on the tool 13 is heated by the infrared heat source 11, and at the same time, the other surface side of the object to be heated provided on the tool 13 is conducted and is heated via the tool 13 by the conduction heat source 12.