Title:
HEATING DEVICE
Document Type and Number:
Japanese Patent JP3039923
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a heating device enabling short-term completion of quick construction on the site, by a method for construction which features a low material cost and inexpensive cost of transportation and construction.
SOLUTION: This heating device is composed of a heat insulating base 4 having a heat insulating function, an adhesive fusion-bonded material layer 2 so provided on the top of the heat insulating base 4 as to cover the whole area thereof and having the heat insulating function, a heat diffusing-radiating plate 1 so provided on the top of the adhesive fusion-bonded material layer 2 as to cover the whole area thereof and a heating body 6 disposed on the heat diffusing-radiating plate 1. Herein, the heat diffusing-radiating plate 1 diffuses the heat emitted by the heating body 6, along the top of the heat insulating base 4.
Inventors:
Hitomi, Takehiko
Ogawa, Michikazu
Ogawa, Michikazu
Application Number:
JP1998000364035
Publication Date:
March 03, 2000
Filing Date:
December 22, 1998
Export Citation:
Assignee:
Hitomi, Takehiko
Ogawa, Michikazu
Ogawa, Michikazu
International Classes:
E01C11/26; E04D13/00; (IPC1-7): E01C11/26; E04D13/00
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