Title:
HEATING DEVICE
Document Type and Number:
Japanese Patent JP3833487
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a heating device which is capable of improving production efficiency and uniformly heating the surface of a board.
SOLUTION: Boards 11 mounted with electronic parts are transferred by a conveyer 12a, preheated in a preheating zone, and then transferred into a reflow zone. The boards 11 are continuously heated in the reflow zone, and a temperature distribution on the surface of the board 11 is detected by a temperature sensor 15. Data on the temperature distribution of the surface of the board detected by the temperature sensor are analyzed by a computer, and a light volume emitted from a light beam device 13 is adjusted on the basis of a difference between the temperature distribution data and the set temperature of the surface of the board 11 so as to make its temperature optimal. As a light beam unit table is moved at a certain speed conforming to the traveling speed of the boards, a light beam of optimal temperature emitted from the light source of the light beam device 13 is made to irradiate a part of the surface of the board whose temperature is lower than a set temperature with pinpoint accuracy for added heat.
Inventors:
Kenichi Maeda
Application Number:
JP2001081199A
Publication Date:
October 11, 2006
Filing Date:
March 21, 2001
Export Citation:
Assignee:
Sharp Corporation
International Classes:
B23K1/00; H05K3/34; B23K1/008; B23K3/04; (IPC1-7): H05K3/34; B23K1/00; B23K1/008; B23K3/04
Domestic Patent References:
| JP8008529A | ||||
| JP2000332404A | ||||
| JP9219582A | ||||
| JP5245624A |
Attorney, Agent or Firm:
Yoshiro Kurauchi
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