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Title:
発熱体状態モニタ
Document Type and Number:
Japanese Patent JP4890760
Kind Code:
B2
Abstract:
A method for monitoring the condition of a heating element involving installing the heating element in a location and setting the initial composition Ci of the material as a reference baseline at an initial time Ti corresponding to said installation of the heating element. Data is then collected reflecting the subsequent composition Cs of the heating element material after a subsequent time Ts at the installed location and any change in the material composition of the heating element between Ti and Ts is monitored. An alarm is sent when the change reaches a threshold value indicating a possible failure condition. According to one embodiment, an impedance monitor is provided that calculates and compares impedance at the required levels of accuracy to determine changes in material composition. The impedance monitor, or portions thereof can be embedded within a microcontroller for increased portability and functionality.

Inventors:
Peck, Kevin Bee.
Johnson, Noel H.
Mckentyre, William Dee.
Bardner, Thomas Jay.
Application Number:
JP2004521905A
Publication Date:
March 07, 2012
Filing Date:
July 17, 2003
Export Citation:
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Assignee:
Sandvik Thermal Process, Incorporated
International Classes:
H01L21/02; G01N17/00; H05B1/02
Domestic Patent References:
JP6102223A
JP4047258A
JP2167463A
Foreign References:
US5754451
US5552998
Attorney, Agent or Firm:
Atsushi Aoki
Jun Tsuruta
Tetsuro Shimada
Kurachi Yasuyuki
Shimichi Akihisa
Masaya Nishiyama



 
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