Title:
加熱基板、保護素子および電子機器
Document Type and Number:
Japanese Patent JP6877607
Kind Code:
B2
Abstract:
To provide a heating substrate capable of securing reliability concerning heating operation.SOLUTION: The heating substrate includes on an entire surface of an insulating substrate 1 provided with a generation hole 4 and a stopping hole 5: an exothermic body 2; and a power feeding terminal 3 for feeding a current to the exothermic body 2. The generation hole 4 is positioned nearer than the exothermic body 2 to the power feeding terminal 3. The stopping hole 5 is positioned nearer than the power feeding terminal 3 to the exothermic body 2.SELECTED DRAWING: Figure 1A
Inventors:
Kazuo Goto
Takeo Kimura
Koji Sato
Takeo Kimura
Koji Sato
Application Number:
JP2020037930A
Publication Date:
May 26, 2021
Filing Date:
March 05, 2020
Export Citation:
Assignee:
Dexerials Co., Ltd.
International Classes:
H05B3/00; H01H37/76; H05B3/20
Domestic Patent References:
| JP7272829A | ||||
| JP9319241A | ||||
| JP5048191U | ||||
| JP2014164867A |
Attorney, Agent or Firm:
Patent Business Corporation Tsubasa International Patent Office