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Title:
HEATING TREATMENT APPARATUS, AND TEMPERATURE TREATMENT APPARATUS
Document Type and Number:
Japanese Patent JP2011044553
Kind Code:
A
Abstract:

To provide a heating treatment apparatus capable of efficiently collecting particles produced during delivery of a substrate when including a heat plate or cooling plate and also including a portion which moves during the delivery of the substrate.

The heating treatment apparatus that performs a heating treatment to the substrate having a coating film formed on a surface thereof includes a heating treatment portion 70 which performs the heating treatment to the substrate, an electrostatic charging plate 77 which electrostatically attracts dust produced at a periphery of the heating treatment portion 70, and a holding table 76 for holding the electrostatic charging plate at a first position above the heating treatment portion 70.


Inventors:
MATSUDA YOSHITAKA
NAKAJIMA NOBORU
YASUNAGA TATSUO
TSUTSUMI KENJI
Application Number:
JP2009191223A
Publication Date:
March 03, 2011
Filing Date:
August 20, 2009
Export Citation:
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Assignee:
TOKYO ELECTRON LTD
International Classes:
H01L21/027; G03F7/38; G03F7/40
Domestic Patent References:
JPS5778137A1982-05-15
JP2007115736A2007-05-10
JP2008277480A2008-11-13
JP2003051523A2003-02-21
JP2009032809A2009-02-12
JPH0739787A1995-02-10
JP2006032957A2006-02-02
JP2008198699A2008-08-28
JP2008166514A2008-07-17
JPH09213597A1997-08-15
JP2002289493A2002-10-04
JPS5778137A1982-05-15
JP2007115736A2007-05-10
JP2008277480A2008-11-13
JP2003051523A2003-02-21
Attorney, Agent or Firm:
Tadahiko Ito



 
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