Title:
HEATING TREATMENT DEVICE AND HEATING TREATMENT METHOD
Document Type and Number:
Japanese Patent JP3494757
Kind Code:
B2
Abstract:
PURPOSE: To prevent the oxidization of copper, printed as a wiring, upon heating a print substrate made of ceramic.
CONSTITUTION: A hot plate 4 is constituted of a plurality of divided bodies 4a, 4b, 4c and a plurality of passages 8 are bored horizontally on the divided body 4a while vertical passages 9 are bored on the divided bodies 4b, 4c and the upper ands of the passages 9 are communicating with the passages 8. Further, inert gas supplying pipes 10 are inserted into the passages 9 from the lower part thereof and inert gas injection ports, connected to the passage 8, are opened on the upper surface of the hot plate 4.
Inventors:
Hirohito Saai
Hideyuki Mizuki
Susumu Okano
Hidenori Miyamoto
Hideyuki Mizuki
Susumu Okano
Hidenori Miyamoto
Application Number:
JP13508595A
Publication Date:
February 09, 2004
Filing Date:
June 01, 1995
Export Citation:
Assignee:
Tokyo Ohka Kogyo Co., Ltd.
International Classes:
F27D5/00; H05K3/46; H05K1/09; H05K3/12; (IPC1-7): F27D5/00
Domestic Patent References:
| JP6123557A | ||||
| JP258697U |
Attorney, Agent or Firm:
Yu Koyama
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