Title:
HERMETICALLY-PACKAGED DEVICES, AND METHODS FOR HERMETICALLY PACKAGING AT LEAST ONE DEVICE AT WAFER LEVEL
Document Type and Number:
Japanese Patent JP2009188402
Kind Code:
A
Abstract:
To provide an airtight packaging device and a method for carrying out airtight packaging, at least for one packaging device at the packaging level of a wafer.
A plurality of devices are hermetically packaged at the packaging level of the wafer by (1) a step 102 for preparing a substrate wafer having a plurality of at least partially formed devices; (2) a step 104 for forming a partition wall around the devices different from the devices at least partially formed on the substrate wafer; and (3) a step for forming a plurality of airtight packages by wafer bonding 106 of a cap wafer on the partition wall.
Inventors:
BONSE MATHIAS
EHLERS ERIC
KASHIWAGI ALAN
EHLERS ERIC
KASHIWAGI ALAN
Application Number:
JP2009017531A
Publication Date:
August 20, 2009
Filing Date:
January 29, 2009
Export Citation:
Assignee:
AGILENT TECHNOLOGIES INC
International Classes:
H01L23/02; B81B3/00; B81C3/00; H01L23/06; H01L23/12; H01H59/00
Attorney, Agent or Firm:
Shoichi Okuyama
Arihara Koichi
Matsushima Tetsuo
Hidefumi Kawamura
Naomi Yoshida
Ayako Nakamura
Masayuki Okamoto
Fukagawa Eri
Satoshi Morimoto
Arihara Koichi
Matsushima Tetsuo
Hidefumi Kawamura
Naomi Yoshida
Ayako Nakamura
Masayuki Okamoto
Fukagawa Eri
Satoshi Morimoto