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Title:
WC-Co切削工具における高密着性ボロンドープ傾斜ダイヤモンド層
Document Type and Number:
Japanese Patent JP7050337
Kind Code:
B2
Abstract:
Improved thin film coatings, cutting tool materials and processes for cutting tool applications are disclosed. A boron-doped graded diamond thin film for forming a highly adhesive surface coating on a cemented carbide (WC—Co) cutting tool material is provided. The thin film is fabricated in a HFCVD reactor. It is made of a bottom layer of BMCD in contact with a surface layer of the cemented carbide, a top layer made of NCD and a transition layer with a decreasing concentration gradient of boron obtained by changing the reaction conditions through ramp up option in hot filament CVD reactor. The top layer has a low friction coefficient. The bottom layer in the coating substrate interface has better interfacial adhesion through cobalt and boron reactivity and decreased cobalt diffusivity in the diamond. The transition layer has minimized lattice mismatch and sharp stress concentration between the top and bottom layers.

Inventors:
Lamas Bramanyan, Canaan
Arnacharam, Narayanan
Lao, Ramachandra
Application Number:
JP2019559034A
Publication Date:
April 08, 2022
Filing Date:
April 26, 2018
Export Citation:
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Assignee:
Indian Institute of Technology Madras (IIT Madras)
International Classes:
C23C16/27; B23B27/14; B23B27/20
Domestic Patent References:
JP5123905A
Other References:
Effect of Boron-Doped Diamond Interlayer on Cutting Performance of Diamond Coated Micro Drills for Graphite Machining,Materials,2013年07月25日,vol. 6,p.3128 - 3138,doi:10.3390/ma6083128
On the development of a dual-layered diamond-coated tool for the effective machining of titanium Ti-6Al-4V alloy,Journal of Physics D: Applied Physics,2016年11月22日,vol. 50, No. 015302
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Shinsuke Onuki