Title:
HIGH DENSITY COMPOUND MOLDING MATERIALS
Document Type and Number:
Japanese Patent JPS5313655
Kind Code:
A
Inventors:
TOUNA TOMOHARU
FUSHIMI OSAMU
KOUNO MASAMI
FUSHIMI OSAMU
KOUNO MASAMI
Application Number:
JP8890176A
Publication Date:
February 07, 1978
Filing Date:
July 26, 1976
Export Citation:
Assignee:
TAIHO KOGYO CO LTD
TOKAI KOGYO CO LTD
TOKAI KOGYO CO LTD
International Classes:
C08L23/00; C08K3/00; C08K3/02; C08K3/08; C08K3/22; C08L23/12; C08L77/00; C08L101/00; (IPC1-7): C08K3/08; C08K3/22; C08L23/12; C08L77/00
Domestic Patent References:
| JP46010949A | ||||
| JP31005890A | ||||
| JPS4858036A | 1973-08-15 | |||
| JPS4734832A | ||||
| JPS506651A | 1975-01-23 | |||
| JPS4920742A | 1974-02-23 |