Title:
HIGH FATIGUE DUCTILITY ELECTRO-DEPOSITED COPPER FOIL
Document Type and Number:
Japanese Patent JP2003201592
Kind Code:
A
Abstract:
To provide an annealable electro-deposited copper foil of high fatigue ductility and durable for long flex cycle.
The annealable electro-deposited copper foil has a substantially uniform unoriented grain structure that is essentially columnar grain free. The copper foil is characterized by a fatigue ductility of at least about 25% after being annealed at 177°C for 15 minutes. In one embodiment, the foil is annealed, and characterized by a fatigue ductility of about 65%. In a manufacturing method of the electro-deposited copper foil, an electrolyte solution characterized by a critical concentration of chloride ions of up to about 5 ppm and organic additives of up to about 0.2 ppm is used.
Inventors:
CLOUSER SIDNEY J
WIECHMANN RUDOLF
SCHNEIDER BERND
BOHMLER ULRIKE
APPERSON R DUANE
WIECHMANN RUDOLF
SCHNEIDER BERND
BOHMLER ULRIKE
APPERSON R DUANE
Application Number:
JP2002362452A
Publication Date:
July 18, 2003
Filing Date:
May 29, 1996
Export Citation:
Assignee:
GA TEK INC
International Classes:
C22F1/08; C22F1/00; C25D1/00; C25D1/04; C25D3/38; C25D5/10; C25D5/50; C25D7/06; H05K1/09; H05K3/38; H05K1/00; (IPC1-7): C25D1/04; C22F1/08; C25D1/00; C25D5/50; C25D7/06
Attorney, Agent or Firm:
Shusaku Yamamoto (2 outside)
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