Title:
高周波回路基板
Document Type and Number:
Japanese Patent JP4629013
Kind Code:
B2
Abstract:
The plate has a coplanar line with a signal strip conductor (21), which is formed linear on an upper surface of a dielectric area and connected with another signal strip conductor (11). A pair of ground conductor paths (22) is formed on base surface of the area in areas corresponding to both sides of signal conductor paths in such a manner that the paths are sustained by a ground wire (15). Another ground conductor path (23) is formed on each side of the paths (22) on the upper surface of the area and connected with an end section of the pair of the paths on the base surface.
Inventors:
Naonori Uda
Tetsuya Katayama
Tetsuya Katayama
Application Number:
JP2006264806A
Publication Date:
February 09, 2011
Filing Date:
September 28, 2006
Export Citation:
Assignee:
株式会社豊田中央研究所
株式会社デンソー
株式会社デンソー
International Classes:
H01P5/08; H01L23/12; H01P3/08
Domestic Patent References:
| JP2001094012A |
Other References:
L.ZHU, K.L.MELDE and J.L.PRINCE,A broadband CPW-to-microstrip via-less transition for on wafer package probing applications,2003 Electrical Performance of Electronic Packaging,米国,IEEE,2003年10月,pp.75 - 78
Attorney, Agent or Firm:
Osamu Fujitani