Title:
高周波回路コンポーネント
Document Type and Number:
Japanese Patent JP4893112
Kind Code:
B2
Abstract:
High-frequency circuit components are disclosed in which parasitic capacitance between a high-frequency circuit element and a substrate is reduced and mechanical strength is improved. An exemplary component has a conductive substrate, a coil as the high-frequency circuit-element, a mounting board including a thin dielectric film on which the coil is mounted, and a support board that couples the mounting board to the substrate. The mounting board is coupled so that it floats relative to the substrate as a result of deliberate warping of the support board.
Inventors:
Mihiko Suzuki
Hiroshi Konishi
Nishiyama Yen
Hiroshi Konishi
Nishiyama Yen
Application Number:
JP2006155497A
Publication Date:
March 07, 2012
Filing Date:
June 03, 2006
Export Citation:
Assignee:
NIKON CORPORATION
International Classes:
H01F27/06; B81B3/00; H01F17/00; H01F17/02
Domestic Patent References:
JP2004221285A | ||||
JP2005251549A | ||||
JP2001076935A | ||||
JP2000150251A | ||||
JP2003209027A | ||||
JP2003245898A | ||||
JP2003218213A | ||||
JP8222694A | ||||
JP2003503816A | ||||
JP2006346830A | ||||
JP2007324495A | ||||
JP2008159661A | ||||
JP2004056133A |
Foreign References:
WO2005022575A1 |
Attorney, Agent or Firm:
Shinomiya Dori