Title:
高周波回路モジュール
Document Type and Number:
Japanese Patent JP5677499
Kind Code:
B2
Abstract:
A high frequency circuit module is provided with: a multilayer circuit substrate; a first high frequency switch that switches connection of an antenna; a transmission filter; and reception filters. Either the transmission filter or the reception filters, or both, and the first high frequency switch are embedded in the multilayer circuit substrate, and ground conductors are formed in a conductive layer facing embedded electronic components.
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Inventors:
佐治 哲夫
中村 浩
中村 浩
Application Number:
JP2013082835A
Publication Date:
February 25, 2015
Filing Date:
April 11, 2013
Export Citation:
Assignee:
太陽誘電株式会社
International Classes:
H04B1/44; H03H9/17; H03H9/54; H03H9/64; H03H9/70; H03H9/72; H03H9/74; H05K3/46