Title:
HIGH FREQUENCY CIRCUIT SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2019080236
Kind Code:
A
Abstract:
To provide a high frequency circuit substrate capable of transmitting high frequency signals for a substrate provided between a signal line and a ground pattern without directly forming a signal line and to provide a manufacturing method for manufacturing such a high frequency circuit substrate by a unified method regardless of the material of the substrate.SOLUTION: The high frequency circuit substrate includes: a first substrate on which a ground pattern is formed on a back side; a second substrate on which a signal line is formed on a front surface side; and a third substrate provided between the back surface of the first substrate and the front surface of the second substrate, forming a transmission line with the ground pattern and the signal line.SELECTED DRAWING: Figure 1
Inventors:
YAMAMOTO TAKAHIRO
YOSHINO YUSHIN
NAKAMURA KEI
YOSHINO YUSHIN
NAKAMURA KEI
Application Number:
JP2017207286A
Publication Date:
May 23, 2019
Filing Date:
October 26, 2017
Export Citation:
Assignee:
FUJIKURA LTD
International Classes:
H01P3/08; H01P11/00; H05K1/14
Attorney, Agent or Firm:
Isshiki International Patent Service Corporation