Title:
HIGH FREQUENCY CIRCUIT
Document Type and Number:
Japanese Patent JP2003209401
Kind Code:
A
Abstract:
To provide a high frequency circuit having a packaging structure in which satisfactory high frequency characteristics can be obtained by closely and easily connecting carriers.
In the high frequency circuit having a first carrier 3 packaged with an IC (LNA1 and LNA2) to be used for the high frequency circuit, a second carrier 6 packaged with an IC (PA 8) to be used for the high frequency circuit, a wire 9 for bonding the IC packaged on the first carrier 3 and the IC packaged on the second carrier 6, and a conductive substance 10 for connecting the first and second carriers, the conductive substance 10 is provided between the first and second carriers while making the distances and the lengths of grounds to the wire 9 approximately equal.
Inventors:
TANAKA KATSUMI
Application Number:
JP2002004236A
Publication Date:
July 25, 2003
Filing Date:
January 11, 2002
Export Citation:
Assignee:
HITACHI INT ELECTRIC INC
International Classes:
H01L23/12; H01P1/04; H01P5/02; (IPC1-7): H01P1/04; H01L23/12; H01P5/02
Attorney, Agent or Firm:
Hisako Ishido (3 outside)
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