Title:
High frequency heating apparatus
Document Type and Number:
Japanese Patent JP6166065
Kind Code:
B2
Abstract:
A high frequency heating apparatus which heats a substrate by applying high frequency waves. The high frequency heating apparatus includes a high frequency generator which generates high frequency to heat the substrate and a reflector which reflects the high frequency generated by the high frequency generator toward the substrate.
Inventors:
Lee Whik
Yun Kyun Min
Cho So-Young
Kwon Yoon Young
Nam Jin Soo
Park Kyun Wook
Choi Jae Young
Yun Kyun Min
Cho So-Young
Kwon Yoon Young
Nam Jin Soo
Park Kyun Wook
Choi Jae Young
Application Number:
JP2013043069A
Publication Date:
July 19, 2017
Filing Date:
March 05, 2013
Export Citation:
Assignee:
Corning Precision Materials Co., Ltd.
International Classes:
H05B6/64
Domestic Patent References:
JP11504153A | ||||
JP46000177A | ||||
JP2004203677A | ||||
JP2004203678A | ||||
JP2003106773A | ||||
JP2013114835A | ||||
JP6259435B2 | ||||
JP6364873B2 |
Foreign References:
US5782947 | ||||
US3704523 | ||||
US20070068937 | ||||
US20110266717 | ||||
WO2013017199A1 | ||||
US3630755 |
Attorney, Agent or Firm:
Fumihiko Yagisawa