Title:
HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
Japanese Patent JP2021174854
Kind Code:
A
Abstract:
To provide a high-frequency module with improved heat dissipation and supporting a multiband.SOLUTION: A high-frequency module 1 comprises: power amplifiers 10A and 20A arranged on a principal surface 91a of a module substrate 91; an external connection terminal 150 arranged on a principal surface 91b; and via conductors 95V and 96V separated in the module substrate 91. One end of the via conductor 95V is connected to a ground electrode 10g of the power amplifier 10A, and the other end is connected to an external connection terminal 150g1. One end of the via conductor 96V is connected to a ground electrode 20g of the power amplifier 20A, and the other end is connected to an external connection terminal 150g2. The via conductor 96V penetrates the module substrate 91 in a normal direction of the principal surface 91a. In the via conductor 95V, a plurality of columnar conductors 95V1 to 95V3 are connected in a cascade manner with a center axis shifted in the normal direction. In a plan view of the module substrate 91, the columnar conductors 95V1 to 95V3 do not have a common overlapping region.SELECTED DRAWING: Figure 3A
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Inventors:
YAMAGUCHI YUKIYA
Application Number:
JP2020076983A
Publication Date:
November 01, 2021
Filing Date:
April 23, 2020
Export Citation:
Assignee:
MURATA MANUFACTURING CO
International Classes:
H04B1/00; H01L23/36; H04B1/38; H05K1/18; H05K7/20
Attorney, Agent or Firm:
Shuichi Yoshikawa
Masao Sakajima
Masao Sakajima