Title:
高周波モジュール及びその製造方法
Document Type and Number:
Japanese Patent JP6747301
Kind Code:
B2
Abstract:
A high frequency module includes: a package section including a semiconductor chip, a first portion of a backshort being integrated with the semiconductor chip by a first resin, and a first rewiring line electrically coupled to the semiconductor chip and including a portion to be an antenna coupler; and a waveguide with which a second portion of the backshort is integrated, wherein the package section and the waveguide are integrated by a second resin, to position the portion to be the antenna coupler between the waveguide and the backshort.
Inventors:
Daijiro Ishibashi
Application Number:
JP2017003521A
Publication Date:
August 26, 2020
Filing Date:
January 12, 2017
Export Citation:
Assignee:
富士通株式会社
International Classes:
H01P5/107; H01L23/12; H01P11/00; H01Q13/02
Domestic Patent References:
| JP2015149671A | ||||
| JP2015177423A | ||||
| JP2015126289A |
Foreign References:
| US20150364830 |
Attorney, Agent or Firm:
Yu Sanada