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Title:
High frequency module
Document Type and Number:
Japanese Patent JP6206919
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a high frequency module which reduces a high frequency propagation loss in a field-through part by connecting a terminal that is installed on a top face of the field-through part inside of a package, and a terminal that is provided on a bottom face of the field-through part outside of the package, without using a via.SOLUTION: The high frequency module includes: a package 20 in which an electronic device is packaged; and a field-through part 60 for propagating a high frequency electric signal between the outside and the inside of the package. The field-through part includes: a first substrate 2 with which electric wires are formed on a first surface 2T that is a surface on the same side as the surface on which the electronic device is packaged, and a second surface 2B that is a rear side of the first surface, respectively, and at least the wire on the second surface includes a high frequency wire; and a second substrate 1 including a third surface 1T on which a high frequency wire corresponding to the wire on the second surface is formed. Outside of the package, both the first surface and the second surface are exposed and inside of the package, the first surface and the third surface are exposed.

Inventors:
Kiyoto Takahata
Kanazawa
Takaharu Oyama
Application Number:
JP2013251453A
Publication Date:
October 04, 2017
Filing Date:
December 04, 2013
Export Citation:
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Assignee:
Nippon Telegraph and Telephone Corporation
International Classes:
H01S5/022
Domestic Patent References:
JP2008166730A
JP2013197285A
JP2012248653A
JP2007012717A
JP2011192939A
JP2004153179A
JP2011129695A
JP20075636A
JP2011155091A
JP2003198201A
JP2012243781A
JP2004288668A
JP11150371A
JP2001308547A
JP20038310A
Attorney, Agent or Firm:
Yoshimoto Toyoda
Hiroshi Watanabe