Title:
HIGH-FREQUENCY PASSIVE COMPONENT
Document Type and Number:
Japanese Patent JP2020092351
Kind Code:
A
Abstract:
To provide a high-frequency passive component capable of suppressing a conductor layer from being peeled off from a substrate.SOLUTION: A high-frequency passive component comprises: a substrate 10 composed of a dielectric body and that has a recessed part; a conductor layer 11, 12 that has a part contacted with the substrate; and a stress relaxation layer 15, 15A formed on the recessed part. An outer peripheral part 11e of the conductor layer is arranged on the stress relaxation layer. The substrate has a through hole 13a. The conductor layer is connected with a through electrode 13 arranged in the through hole. The high-frequency passive component comprises a waveguide structure configured to surround a waveguide region by wide walls formed on both surfaces of the substrate and the through electrode connected with the respective wide walls formed on both surfaces. A dielectric layer 16 is provided on the conductor layer. At least a part of an inner peripheral part 11b of the conductor layer is arranged between the stress relaxation layer and the dielectric layer. The dielectric body that composes the substrate is composed of glass, and the stress relaxation layer is composed of resin.SELECTED DRAWING: Figure 2
Inventors:
TSUCHIYA SHINNOSUKE
Application Number:
JP2018229086A
Publication Date:
June 11, 2020
Filing Date:
December 06, 2018
Export Citation:
Assignee:
FUJIKURA LTD
International Classes:
H01P3/12; H01P11/00
Attorney, Agent or Firm:
Sumio Tanai
Mitsunaga Igarashi
Toshio Komuro
Yuichiro Shimizu
Mitsunaga Igarashi
Toshio Komuro
Yuichiro Shimizu