Title:
HIGH-FREQUENCY SUBSTRATE
Document Type and Number:
Japanese Patent JP2018160637
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a high-frequency substrate which is inexpensive and excellent in heat dissipation, which can enhance heat dissipation of the high-frequency substrate mounted with high density and can protect an electronic device from heat generation over a long period of time.SOLUTION: A high-frequency substrate according to the present invention includes a resin film formed with a ceramic film made of aluminum nitride between a glass epoxy board (FR-4) for supplying large power and a substrate for high frequency signal high speed transmission in which a copper layer is formed on at least one surface of a substrate selected from a group consisting of a fluororesin having a low dielectric constant of 5 or less (1GHz), a cycloolefin polymer, and a liquid crystal polymer.SELECTED DRAWING: None
Inventors:
KITAGAWA NAOAKI
Application Number:
JP2017058318A
Publication Date:
October 11, 2018
Filing Date:
March 24, 2017
Export Citation:
Assignee:
SUMITOMO METAL MINING CO
International Classes:
H05K1/14; B32B15/04; B32B18/00; B32B27/38; H05K1/03; H05K3/46