Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
高周波スイッチモジュール
Document Type and Number:
Japanese Patent JP5122602
Kind Code:
B2
Abstract:
A high-frequency switch module which comprises a high-frequency switch circuit connected among an antenna, a transmission circuit, and a reception circuit and comprising switching elements and a surface acoustic wave filter connected between the high-frequency switch circuit and the reception circuit, uses a laminate constituted of dielectric layers having electrode patterns as the multilayered board, and has a phase correction circuit disposed between the switch circuit and the surface acoustic wave filter, wherein the high-frequency switch circuit comprises a switching element, a transmission line, and a capacitor as main elements, with at least a part of the transmission line and the capacitor constituted of an electrode pattern in the laminate, and with the surface acoustic wave filter mounted on the laminate.

Inventors:
Shigeru Kamochi
Mitsuhiro Watanabe
Hiroyuki Tadai
Fukamachi Keisuke
Satoshi Yokouchi
Application Number:
JP2010094432A
Publication Date:
January 16, 2013
Filing Date:
April 15, 2010
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Hitachi Metals Co., Ltd.
International Classes:
H04B1/44; H01P1/15; H03H7/01; H03H7/075; H03H7/42; H03H7/46; H03H9/25; H03H9/64; H04B1/48; H05K1/18; H04B1/40; H05K1/00; H05K1/02; H05K1/03; H05K1/16
Domestic Patent References:
JP1032521A
JP2000278168A
JP200077969A
JP8125413A
JP6325949A
JP2000331835A
JP5598028U
JP10117123A
JP2000223314A
JP2000101378A
Attorney, Agent or Firm:
Takaishi Tachibana



 
Previous Patent: JPS5122601

Next Patent: VIDEO SIGNAL PROCESSOR