To provide a high-heat radiation plastic package which has less bleeding of a resin of an adhesive material, is low in cost, exhibits high bonding accuracy and is thin without using a resin substrate comprising a glass cloth and a thick adhesive material such as a pre-preg, etc. for bonding with a heat dissipation plate.

A resin film 11 with Cu foil which is formed by bonding an adhesive resin 13 to the Cu foil has an almost quadrangular through-hole 15 for surrounding a semiconductor element 14. On a Cu layer 12 having heat radiation action for radiating the heat generated from the semiconductor element 14 by the resin film 11 with Cu foil, a cavity 16 for mounting the semiconductor element 14 by directly bonding by the adhesive resin 13 is provided in the high heat radiation plastic package 10. A frame body 17 which can be engaged with the wall surface of the through-hole 15 formed in the resin film 11 with Cu foil is provided on the surface side bonded to the resin film 11 with Cu foil of the Cu layer 12.