Title:
電気めっきＭＥＭＳ構造の高融点シード金属
Document Type and Number:
Japanese Patent JP6820913
Kind Code:
B2
Abstract:
A system and method for a micro-electrical-mechanical system (MEMS) device including a substrate and a free-standing and suspended electroplated metal MEMS structure formed on the substrate. The free-standing and suspended electroplated metal MEMS structure includes a metal mechanical element mechanically coupled to the substrate and a seed layer mechanically coupled to and in electrical communication with the mechanical element, the seed layer comprising at least one of a refractory metal and a refractory metal alloy, wherein a thickness of the mechanical element is substantially greater than a thickness of the seed layer such that the mechanical and electrical properties of the free-standing and suspended electroplated metal MEMS structure are defined by the material properties of the mechanical element.
Inventors:
Brewer, Joraine Aileen
Keimel, Christopher Fred
Aimi, Marco Francesco
Minnick, Andrew James
Ruffalo, Renner Stefan
Keimel, Christopher Fred
Aimi, Marco Francesco
Minnick, Andrew James
Ruffalo, Renner Stefan
Application Number:
JP2018511120A
Publication Date:
January 27, 2021
Filing Date:
July 13, 2016
Export Citation:
Assignee:
GENERAL ELECTRIC COMPANY
International Classes:
B81B3/00; B81C1/00; H01H59/00
Domestic Patent References:
| JP2011091029A | ||||
| JP2012086315A | ||||
| JP2010214480A | ||||
| JP2014075193A | ||||
| JP2003311698A | ||||
| JP2011097038A | ||||
| JP6154729B2 | ||||
| JP6063475B2 |
Attorney, Agent or Firm:
Kazuya Sekiguchi
Arakawa Satoshi
Hirokazu Ogura
Takuto Tanaka
Arakawa Satoshi
Hirokazu Ogura
Takuto Tanaka