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Title:
HIGH MOLECULAR COMPOUND FOR PHOTORESIST AND PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2002351078
Kind Code:
A
Abstract:

To obtain a high molecular compound having high etching resistance in the case of being used for a photoresist.

The high molecular compound contains at least one kind of a monomer unit selected from formulas (1a) and (1b). (In the formulas, R1 represents a hydrogen atom, a 1-5C hydrocarbon group, a hydroxyl group which can be protected by a protective group, a -COOR3 group or the like. The R3 represents a hydrogen atoms, a tertiary hydrocarbon group which can have a substituent group, a tetrahydro furanyl group or the like. Y represents a univalent alicyclic group which can have a substituent group. (n) represents 0, 1 or 2. R2 represents a hydrogen atom, a 1-20C hydrocarbon group, a hydroxyl group which can be protected by a protective group, or the like, L represent a lactone ring of ≥5 members. Norbornane ring in the formula can have a substituent group in addition to the substituent group expressed by the formula.


Inventors:
TSUTSUMI KIYOHARU
INOUE KEIZO
FUNAKI KATSUNORI
NAKANO TATSUYA
HORAI AKIRA
Application Number:
JP2001153172A
Publication Date:
December 04, 2002
Filing Date:
May 22, 2001
Export Citation:
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Assignee:
DAICEL CHEM
International Classes:
G03F7/039; C07C49/553; C07D307/00; C08F32/00; H01L21/027; (IPC1-7): G03F7/039; C07C49/553; C07D307/00; C08F32/00; H01L21/027
Attorney, Agent or Firm:
Yukihisa Goto