Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
HIGH RESOLUTION THICK FILM PRINTING METHOD
Document Type and Number:
Japanese Patent JPH0677625
Kind Code:
A
Abstract:

PURPOSE: To perform printing while sustaining high resolution by preventing the line width from becoming wide when a thick film circuit is printed on the surface of a board through offset printing.

CONSTITUTION: First time printing is performed while setting the distance between a transfer roll and the surface of board to be printed equal to the thickness of paste transferred onto the surface of a transfer roll. Second to n-th time printings are repeated several times while setting the distance dn between the transfer roll and the surface of board to be printed according to a formula; dn-1≤dn≤dn-1+Tn (n≥2), where dn-1 is the distance between the transfer roll and the surface of board to be printed at the time of (n-1)th printing and Tn is the thickness of paste transferred onto the transfer roll at the time of n-th printing.


Inventors:
SASAKI KAZUYA
TAMEMASA HIROSHI
Application Number:
JP7859292A
Publication Date:
March 18, 1994
Filing Date:
February 28, 1992
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TANAKA PRECIOUS METAL IND
International Classes:
B41F17/14; B41M1/06; H05K3/12; (IPC1-7): H05K3/12; B41F17/14; B41M1/06