Title:
HIGH-SPEED COPPER ELECTROPLATING SOLUTION
Document Type and Number:
Japanese Patent JPS589996
Kind Code:
A
Abstract:
PURPOSE:To obtain a high-speed copper electroplating soln. forming thick and flat electrolytic copper in a short time by adding picolinate ion to a copper electroplating soln. contg. bivalent copper ion, pyrophosphate ion and a pH regulator. CONSTITUTION:To a copper electroplating soln. contg. bivalent copper ion, pyrophosphate ion and a pH regulator as essential components is added picolinate ion and preferably added an aminopolycarboxylic acid type chelating agent for bivalent copper ion. The preferred chelating agent is ethylenediaminetetraacetic acid, an alkali metallic salt thereof, ethylenediaminepentaacetic acid or an alkali salt thereof. The optimum concn. of picolinic acid added to the plating soln. is 0.0041-0.081mol/l, and that of the chelating agent is 0.0054-0.21mol/l. The stability of the plating soln. is improved, and current density about 10 times the conventional current density can be applied.
Inventors:
OKA HITOSHI
TAGUCHI NORIYUKI
NIIZAKI SHINYA
ISOGAI TOKIO
WATABE TAKAYOSHI
TAGUCHI NORIYUKI
NIIZAKI SHINYA
ISOGAI TOKIO
WATABE TAKAYOSHI
Application Number:
JP10694681A
Publication Date:
January 20, 1983
Filing Date:
July 10, 1981
Export Citation:
Assignee:
HITACHI LTD
International Classes:
C25D3/38; (IPC1-7): C25D3/38
Attorney, Agent or Firm:
Junnosuke Nakamura
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