PURPOSE: To inexpensively obtain a die bonding device at a high speed by removing a picking and placing mechanism, moving it directly above a semiconductor frame, isolating a die from an adhesive sheet, and simultaneously adhering it on the frame.

CONSTITUTION: An adhesive sheet 4 is formed by extending fixedly a die ring 9 with a clamping ring 10 at the outside of the circumference of the ring, an arm 11 is connected to the ring 9 and X, Y, O tables to sequentially move semiconductor dies 3 secured by the sheet 4 to the bonding positions of the frame to predetermined positions directly above the frame. The dies 3 secured by the sheet 4 to the pattern side 3a are isolated by the movement of a collet tool 8, and adhered with an adhesive 6 coated in advance on the frame 7 to complete the bonding. Accordingly, the bonding becomes only the elevational movements of the collet tool, picking and placing units are eliminated, thereby obtaining a high speed die bonding device inexpensively.