PURPOSE: To obtain the titled copper alloy having excellent electric and heat conductivity, mechanical characteristics, oxidation film adhesion, solderability, heat resistance, press moldability and bendability by adding specific amounts of Cr, Zr, etc., to Cu.

CONSTITUTION: The Cu-based alloy contg., by weight, 0.1W0.3% Cr, 0.3W1.0% Zr and 0.01W1.0% Si, or furthermore contg. 0.01W1.0% total amount of one or more kinds selected from the group consisting of Al, Be, Co, Fe, Hf, Mg, Ni, P, Sn, Ti and Zn is refined. The material is formed, e.g., into 0.25mm thin plate by Cu alloy rolling to produce a Cu alloy material having excellent characteristics as the lead material of a semiconductor device and as an electric conductive spring material.