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Patent Searching and Data


Title:
HIGH-STRENGTH HIGH-ELECTRICALLY-CONDUCTIVE COPPER ALLOY WITH SUPERIOR WELDABILITY
Document Type and Number:
Japanese Patent JPS55104449
Kind Code:
A
Abstract:

PURPOSE: To enhance the weldability of a high-strength high-electrically-conductive copper alloy used as a material for the damper shield, etc. of a large capacity superconductive generator by adding a specified amt. of Ni and Si to copper.

CONSTITUTION: An alloy consisting of Ni 1.3W2.5wt%, Si 0.3W0.6wt%, and the balance Cu and inevitable impurities. The Ni and Si contents of the alloy is appropriately adjusted to a ratio in which a Ni5, Si2 intermetallic cpd. is formed. The Ni and Si are mostly being dissolved in the copper before welding, and the Ni-Si intermetallic cpd. precipitates in an about equilibrium state at a desired temp. after welding. Accordingly, occurrence of weld cracks is prevented, and satisfactory welding results are obtd. by putting a Ni alloy on a groove even in welding to an iron alloy. By making use of this alloy no weld crack occurs in a damper shield, etc., and superior strength and electrical conductivity are provided.


Inventors:
MORI SHIGENOBU
KIRIHARA SEISHIN
SAKAMOTO MASAHIKO
Application Number:
JP1043279A
Publication Date:
August 09, 1980
Filing Date:
February 02, 1979
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
C22C9/00; C22C9/06; H01L39/00; H02K15/02; (IPC1-7): C22C9/06; H01L39/00; H02K15/02