Title:
高強度シラン変性ポリマー接着剤組成物
Document Type and Number:
Japanese Patent JP7440518
Kind Code:
B2
Abstract:
Disclosed is a moisture curable adhesive composition comprising at least one silane-modified polymer, a filler comprising a surface modified fumed silica and one of a surface modified cristobalite and a silica; and optionally, at least one of an aminosilane adhesion promotor, an organotin catalyst, a dehydration shelf life enhancer, a light stabilizer, titanium dioxide, a rheology modifier, and mixtures thereof. The adhesive composition finds special use in bonding metal substrates to each other with significantly higher bond strength than that provided by silane-modified polymer adhesives alone.
Inventors:
Veroski, Christopher
Cole, Matthias
Cole, Matthias
Application Number:
JP2021533477A
Publication Date:
February 28, 2024
Filing Date:
December 10, 2019
Export Citation:
Assignee:
Henkel AG & Co. KGaA
International Classes:
C09J201/10; C09J11/04; C09J11/06; C09J133/00; C09J171/00
Domestic Patent References:
| JP2010261010A | ||||
| JP2012167210A | ||||
| JP2003193022A | ||||
| JP2018522108A |
Attorney, Agent or Firm:
Katsuhiro Ito