Title:
高温鉛フリーはんだおよび半導体素子収納用パッケージ
Document Type and Number:
Japanese Patent JP4305511
Kind Code:
B2
Abstract:
[PROBLEMS] Recently, a lead-free solder containing Sn as a main component has been frequently used from the view point of regulatory constrains to Pb. The lead-free solder has a liquidus line temperature near 220°C, and therefore, when the lead-free solder is used for mounting, a high temperature solder is required to have a solidus line temperature of 270°C or higher. An Au-Sn eutectic alloy is known to have a solidus line temperature of 270°C or higher. The eutectic alloy is expensive, since it has a high content of Au. [MEANS FOR SOLVING PROBLEMS] A high temperature solder which contains 2 to 12 mass % of Ag, 40 to 55 mass % of Au and the balanced amount of Sn; and a package for storing a semiconductor in which a body of a container and a lid member is joined by the use of said high temperature solder.
Inventors:
Rikiya Kato
Takenori Azuma
Takenori Azuma
Application Number:
JP2006543117A
Publication Date:
July 29, 2009
Filing Date:
October 24, 2005
Export Citation:
Assignee:
Senju Metal Industry Co., Ltd.
International Classes:
B23K35/26; B23K35/30; C22C5/02; C22C13/00; H01L23/02; H01L23/10
Domestic Patent References:
| JP2003260587A | ||||
| JP55020403A | ||||
| JP2001009587A |
Other References:
MAVOORI et al,Lead-Free Universal Solders for Optical and Electronic Devices.,Journal of ELECTRONIC MATERIALS,米国,2002年11月,Vol.31 No.11,Page.1160-1165