Title:
HIGH TEMPERATURE SUPERCONDUCTING MATERIAL
Document Type and Number:
Japanese Patent JPH01290526
Kind Code:
A
Abstract:
PURPOSE: To obtain a high temp. superconducting material having ≥90°K critical temp. and usable as the wiring material of an Si semiconductor integrated circuit device by incorporating boron into a high temp. superconducting material of ceramic such as Y1Ba2Cu3O7.
CONSTITUTION: Boron is incorporated into the surface of a high temp. superconducting material of ceramic such as Y1Ba2Cu3O7 by diffusion or ion implantation. The critical temp. of the surface of the high temp. superconducting material can be increased to ≥90°K. By using B2O3 powder in the production of the high temp. superconducting material, B is substd. for all or part of Y and a high temp. superconducting material of ceramic such as B1Ba2Cu3O7 or Y0.5B0.5Ba2Cu3O7 can be obtd.
Inventors:
IWAMATSU SEIICHI
Application Number:
JP12088888A
Publication Date:
November 22, 1989
Filing Date:
May 18, 1988
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
C04B35/00; C01G1/00; C01G3/00; C04B35/45; H01B12/00; H01L39/12; (IPC1-7): C01G3/00; C04B35/00; H01B12/00; H01L39/12
Domestic Patent References:
| JPS57156637U | 1982-10-01 | |||
| JPS5824537U | 1983-02-16 | |||
| JPS3310305B1 |
Attorney, Agent or Firm:
Masanori Ueyanagi (1 outside)