Title:
高熱伝導性コンパウンド
Document Type and Number:
Japanese Patent JP5489409
Kind Code:
B2
Abstract:
The present invention provides a highly thermal conductive compound which has a high thermal conductivity, has a high consistency and a good coating workableness, and is excellent in thermal stability at a high temperature. A highly thermal conductive compound containing (A) 85 to 97% by mass of an inorganic powder filler, (B) 2 to 15% by mass of a base oil, and (C) 0.001 to 10% by mass of a compound represented by Y—(—R2—COO—)n—R1—X (wherein R1 and R2 each is a bivalent hydrocarbon group having a linear or branched chain having 1 to 36 carbon atoms, n is 1 to 15, X and Y each is at least one substituent selected from the group consisting of a carboxyl group and a hydroxyl group or a hydrogen atom, and at least one of X and Y is a carboxyl group or a hydroxyl group.
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Inventors:
Takatsugu Hiratsuka
Application Number:
JP2008023955A
Publication Date:
May 14, 2014
Filing Date:
February 04, 2008
Export Citation:
Assignee:
Cosmo Oil Lubricants Co., Ltd.
International Classes:
C09K5/08; C10M141/02; C10M169/04; H01L23/36; C10M107/02; C10M107/32; C10M125/00; C10M125/04; C10M125/10; C10M129/40; C10M129/95; C10N30/00; C10N40/00; C10N50/10
Foreign References:
| US5098609 | ||||
| US5591789 | ||||
| US5827331 |
Attorney, Agent or Firm:
Shinobu Orikuchi