Title:
高熱伝導率のヒートシンク
Document Type and Number:
Japanese Patent JP4880447
Kind Code:
B2
Abstract:
The invention relates to a heat sink comprising a diamond-containing composite material. In addition to a diamond content of 40-90% by volume, the composite material further comprises from 0.005 to 12% by volume of a silicon-carbon compound, from 7 to 49% by volume of an Ag-, Au- or Al-rich phase and less than 5% by volume of a further phase, with the volume ratio of the Ag-, Au or Al-rich phase to silicon carbide being greater than 4 and at least 60% of the diamond surface being covered by the silicon-carbon compound. Preferred production processes include atmospheric pressure and pressure-aided infiltration techniques. The component is suitable, in particular, as heat sink for semiconductor components.
Inventors:
Luteque, Arnto
Application Number:
JP2006503938A
Publication Date:
February 22, 2012
Filing Date:
January 20, 2004
Export Citation:
Assignee:
Plansee SA
International Classes:
C04B35/634; C04B35/52; C04B35/653; C04B41/88; C22C1/05; C22C1/10; C22C26/00; H01L23/373
Domestic Patent References:
| JP2001339022A | ||||
| JP2199062A | ||||
| JP4259305A |
Foreign References:
| US6179886 | ||||
| WO2002042240A1 |
Attorney, Agent or Firm:
Iwao Yamaguchi