PURPOSE: To obtain a highly dielectric compsn. excellent in heat resistance, moldability, and high-temp. mechanical characteristics by compounding a polyamic acid, a soluble polyimide, a nitric acid compd., and a dipivaloylmethane compd.
CONSTITUTION: The compsn. comprises at least one matrix resin selected from the group consisting of a polyamic acid of formula I, a polyamic acid of formula II having alkoxyl groups in the molecular chain, a polyamic acid of formula III having alkoxyl groups at the molecular ends, a solvent-soluble polyimide of formula IV, a solvent- soluble polyimide of formula V having alkoxyl groups in the molecular chain, and a solvent-soluble polyimide of formula VI having alkoxyl groups at the molecular ends and at least one compd. selected from the group consisting of compds. of formulae VII and VIII and a dipivaloylmethane compd. of formula IX. In formulae I to VI, R1 is a tetravalent org. group; R2 is a divalent org. group; R3 is a trivalent org. group; R4 is a di- to tetravalent org. group; R5 is a monovalent org. group; m≥1; n≥1; and k is 1-3. In formulae VII to IX, M is a metal atom; and n is the valence of the atom.
FUJIMOTO TAKAMITSU
BABA FUMIAKI
ANDO TORAHIKO
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