Title:
生産性に優れたギャングボンディングプロセス用アンダーフィル絶縁フィルム
Document Type and Number:
Japanese Patent JP7066350
Kind Code:
B2
Abstract:
To provide an underfill insulating film suitable for a gang bonding process, which can solve problems such as poor conduction and occurrence of voids in the gang bonding process.SOLUTION: There is provided an underfill insulating film for a gang bonding process including (a) 10 to 40 parts by mass of at least one resin component selected from phenoxy resin, polyimide resin, polyamide imide resin, polyamide resin, and acrylic resin, (b) 20 to 85 parts by mass of a heat radical polymerizable material, (c) 0 to 65 parts by mass of epoxy resin, (d) 0.1 to 5 parts by mass of a heat radical generator (here, each content of (a), (b), (c), and (d) is parts by mass per 100 parts by mass of the total of (a), (b), and (c)).SELECTED DRAWING: Figure 2
More Like This:
Inventors:
Hiroto Yasui
Kinoshita Hitoshi
Tetsumitsu Morimoto
Kinoshita Hitoshi
Tetsumitsu Morimoto
Application Number:
JP2017150376A
Publication Date:
May 13, 2022
Filing Date:
August 03, 2017
Export Citation:
Assignee:
Mitsui Chemicals Tohcello Co., Ltd.
International Classes:
H01L21/60; C09J7/00; C09J11/06; C09J133/00; C09J163/00; C09J171/12; C09J179/08; H01L23/29; H01L23/31
Domestic Patent References:
| JP2017098331A | ||||
| JP2015503220A | ||||
| JP2017114960A | ||||
| JP2017045891A |
Attorney, Agent or Firm:
Asamura patent office