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Title:
HIGHLY RIGID COPPER-CLAD LAMINATED PLATE AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JPH08216340
Kind Code:
A
Abstract:

PURPOSE: To provide a copper-clad laminated plate whose rigidity is improved without damaging other properties and a method for manufacturing the plate.

CONSTITUTION: In a copper-clad laminated plate consisting of a composite material layer consisting of a glass cloth having 55% or above of volume content and a resin and of a copper foil formed on at least one face of the layer, the copper-clad laminated plate having a resin layer of 1-5μm in between the composite material layer and the copper foil and one or a plurality of prepregs obtained by impregnating the glass cloth having 55% or above of volume content with resin and drying them are layered. At least on its one face, the copper foil having an adhesive layer having a thickness of 1-5μm formed on a face in contact with the prepreg is superposed so as to integrate by pressure molding with heat.


Inventors:
OKANO TOKUO
KOBAYASHI KAZUHITO
NAKASO AKISHI
Application Number:
JP2178695A
Publication Date:
August 27, 1996
Filing Date:
February 09, 1995
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
B32B15/08; B32B17/04; H05K1/03; (IPC1-7): B32B15/08; B32B15/08; B32B17/04; H05K1/03
Attorney, Agent or Firm:
Kunihiko Wakabayashi



 
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