HIGHLY THERMAL CONDUCTIVE GREASE, ITS PREPARATION PROCESS, AND METHOD OF USING THE SAME

Title:

HIGHLY THERMAL CONDUCTIVE GREASE, ITS PREPARATION PROCESS, AND METHOD OF USING THE SAME

Document Type and Number:

Japanese Patent JP2004026964

Kind Code:

A

Abstract:

To provide a highly thermal conductive grease, which is to be placed between a heat generating component and a heat sink to effectively carry out heat emitting and absorbing processes, wherein the thermal conductivity is much higher than that of a conventional silicone grease, and also to provide its preparation process and the method of using the same.

The grease is prepared by incorporating a marketed silicone grease with ultrafine particles having the thermal conductivity at least higher than that of a copper material. The grease is placed, for example, between the electronic component 2 such as transistor and the heat sink 4 to promote effective heat emission of an electronic component 2.

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Inventors:

OUCHI KAZUMI
KASAHARA KEISUKE
ATODA MINORU

Application Number:

JP2002183887A

Publication Date:

January 29, 2004

Filing Date:

June 25, 2002

Export Citation:

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Assignee:

YVO INC
KASAHARA KEISUKE
PMC SERVICE KK

International Classes:

C10M169/02; C10M107/50; C10M125/02; C10N20/00; C10N20/06; C10N50/10; C10N70/00; (IPC1-7): C10M169/02; C10M107/50; C10M125/02

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