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Title:
HOLDING DEVICE FOR WAFER
Document Type and Number:
Japanese Patent JPH04101795
Kind Code:
A
Abstract:

PURPOSE: To eliminate the rubging of a wafer with its pushing, and to damage no wafer, nor dusting, even in case of there being the misregistrations of wafer and gripper, in the wafer holding, by providing a piezoelectric element for opening and closing a claw and a detection means which detects the holding force of the wafer and claw.

CONSTITUTION: The displacements of piezoelectric elements 12-15 are transmitted to claws 17, 18, the contact force with two claws 17, 18 and a wafer 1 is detected simultaneously, the contact force is increased in the range that the wafer 1 is not moved, with the claw of a weaker contact force being displaced further, the contact force is increased with this being performed alternately, and the wafer 1 is held. Consequently, the wafer 1 can be held, without moving the wafer 1.


Inventors:
AZUMA HITOSHI
SUZUKI TAKAMICHI
HAMADA TOYOHIDE
AKAIWA MASAYASU
DAIROKU NORIYUKI
Application Number:
JP21424590A
Publication Date:
April 03, 1992
Filing Date:
August 15, 1990
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
B23Q7/04; B25J15/08; B65G49/07; (IPC1-7): B23Q7/04; B25J15/08
Attorney, Agent or Firm:
Katsuo Ogawa (1 person outside)



 
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