Title:
HOLDING MECHANISM
Document Type and Number:
Japanese Patent JP2022059360
Kind Code:
A
Abstract:
To provide a holding mechanism which can hold a frame securely even if the frame is not positioned in a sufficiently precise manner.SOLUTION: A holding mechanism 2 includes: a wafer holding part 4 which suctions and holds a wafer; and frame support parts 6 which are disposed at an outer periphery of the wafer holding part 4 and support a frame 36. The frame support part 6 includes a permanent magnet 12.SELECTED DRAWING: Figure 1
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Inventors:
SAITO YOSHINOBU
KAKINUMA YOSHINORI
MORI TAKASHI
KAKINUMA YOSHINORI
MORI TAKASHI
Application Number:
JP2020167052A
Publication Date:
April 13, 2022
Filing Date:
October 01, 2020
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
H01L21/683; B23Q3/08; B23Q3/15; B24B41/06; H01L21/301
Attorney, Agent or Firm:
Naozumi Ono
Okunuki Sachiko
Tsuyoshi Tsukano
Yoshifumi Kaneko
Okunuki Sachiko
Tsuyoshi Tsukano
Yoshifumi Kaneko