Title:
HOLDING MEMBER, TRANSFER MEMBER, MANUFACTURING METHOD OF HOLDING MEMBER, MANUFACTURING METHOD OF TRANSFER MEMBER, AND MANUFACTURING METHOD OF LIGHT EMITTING SUBSTRATE
Document Type and Number:
Japanese Patent JP2020174129
Kind Code:
A
Abstract:
To increase the productivity of a light emitting substrate on which a plurality of light emitting diode chips are arranged.SOLUTION: A holding member includes a holding member 30 that holds a plurality of light emitting diode chips 50, a translucent base material 31 having a two-dimensionally arranged first region 311 and a second region 312 other than the first region 311, a plurality of protrusions 32 provided on the surface 31a on one side of the base material 31 and provided in the first region 311, a light-shielding portion 34 provided in the second region 312 on the surface 31a on one side of the base material 31, and an adhesive layer 33 provided on the tip surface of the protrusion 32.SELECTED DRAWING: Figure 5
More Like This:
Inventors:
MASUDA KENJI
KAWAGUCHI SHUJI
MATSUURA DAISUKE
YOSHI NAONOBU
KAWAGUCHI SHUJI
MATSUURA DAISUKE
YOSHI NAONOBU
Application Number:
JP2019075106A
Publication Date:
October 22, 2020
Filing Date:
April 10, 2019
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD
International Classes:
H01L21/60; H01L21/52; H01L33/48
Domestic Patent References:
| JP2010245557A | 2010-10-28 | |||
| JP2005045074A | 2005-02-17 | |||
| JP2019506737A | 2019-03-07 | |||
| JP2002343944A | 2002-11-29 |
Attorney, Agent or Firm:
Hiroyuki Nagai
Yukitaka Nakamura
Satoru Asakura
Yukihiro Hotta
Enonami Kaoru
Yukitaka Nakamura
Satoru Asakura
Yukihiro Hotta
Enonami Kaoru