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Title:
HOLDING PAD
Document Type and Number:
Japanese Patent JP2022055510
Kind Code:
A
Abstract:
To provide a holding pad that can be easily joined to another holding pad by thermal fusion bonding and enables bonded bodies in uniform shapes to be obtained.SOLUTION: A holding pad 1 according to the present embodiment comprises a holding surface 2Sa for holding an object to be polished and a resin layer 2 having a bonding surface 2Sb different from the holding surface 2Sa, where a PET film 3 as a base material is arranged at the opposite surface side of the bonding surface 2Sb of the resin layer 2. A temperature at which the resin layer 2 starts to flow is in a range of 150°C-200°C, and voidage in the bonding surface 2Sb is 40-60%.SELECTED DRAWING: Figure 1

More Like This:
WO/1996/005497POLISHING DEVICE WITH SPECIMEN-HOLDER
JP3072962[Title of the Invention] A holder for a work piece for polishing and a method for producing the same.
Inventors:
KUME TAKAHIRO
TANAKA HISAAKI
Application Number:
JP2020162972A
Publication Date:
April 08, 2022
Filing Date:
September 29, 2020
Export Citation:
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Assignee:
FUJIBO HOLDINGS INC
International Classes:
B24B37/30; B24B41/06; H01L21/304
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito



 
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