Title:
保持テーブル、加工装置、及び、スピンナー洗浄ユニット
Document Type and Number:
Japanese Patent JP7436250
Kind Code:
B2
Abstract:
To provide a holding table newly configured in consideration of a problem caused in a holding table due to deterioration of an adhesive for fastening a porous plate.SOLUTION: A holding table 50, which holds a work-piece (a wafer 10), comprises: a porous plate 51 including a holding surface 51a on which the work-piece is held, a back surface 51b at the opposite side of the holding surface and a side surface 51c leading from the holding surface to the back surface; and a resin frame 52 formed integrally with the porous plate 51 to cover the holding surface 51a, the back surface 51b and the side surface 51c of the porous plate 51. In the holding table 50, a suction passage 52a communicated with the porous plate 51 is formed in the resin frame 52.SELECTED DRAWING: Figure 3
More Like This:
| JP2023101146 | CLEANING MECHANISM |
| JP3172710 | Manual polishing device |
Inventors:
Yuichi Kitazumi
Tomoaki Endo
Hiroshi Nomura
Tomoaki Endo
Hiroshi Nomura
Application Number:
JP2020044154A
Publication Date:
February 21, 2024
Filing Date:
March 13, 2020
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
B23Q3/08; B24B41/06; B24B55/06; H01L21/683
Domestic Patent References:
| JP2018200972A | ||||
| JP2004298970A | ||||
| JP11010472A | ||||
| JP2019161055A | ||||
| JP2010010267A | ||||
| JP2010283286A | ||||
| JP7156035A |
Attorney, Agent or Firm:
Hiroshi Ogami
Previous Patent: cement clinker
Next Patent: Die bonding equipment and semiconductor device manufacturing method
Next Patent: Die bonding equipment and semiconductor device manufacturing method